CeramTec at PCIM Europe in Nuremberg

Meet the ceramic experts at the leading trade fair
for power electronics

CeramTec presented highly efficient ceramic cooling systems at PCIM from June 5 to 7, 2018. These systems are used for thermal management in power electronics and as 3D substrate metalizations in structure copper technology for high-performance electronic circuits.

Impressions from PCIM 2017
 

PCIM Europe in Nuremberg is the leading international trade fair for power electronics, intelligent drive engineering, renewable energies and energy management. Every year, key industry suppliers from around the world meet here to showcase the latest developments in power semiconductors, passive components, products for thermal management, intelligent drive engineering and new materials and sensors.

Video CeramCool® Sandwich Cooling system for double-sided cooling

CeramTec's theme was “Advanced Ceramics in Electronic Applications”. The company presented advanced cooling concepts based on ceramic heat-sinks that enable a significant reduction in thermal resistance and thus thermal conductivity of 600 W/cm2 across the surface. The company was also showcasing three-dimensional metalized substrates featuring structured copper technology (SCT) for highly integrated circuits.

Thank you very much for your interest in advanced ceramics by CeramTec and your visit to our exhibition booth! Your CeramTec PCIM Europe in Nuremberg team.

Worth knowing:

CeramTec at PCIM Europe 2018

  • June 5 to 7, 2018
  • Messezentrum Nürnberg
  • Hall 7, Stand 411
  • Daily from 9:00 am to 5:00 pm

CeramTec Highlights at PCIM Europe 2018

CeramCool® heat-sinks

The ceramic CeramCool® heat-sinks are a CeramTec development and offer an effective combination of circuit board and heat-sink for the reliable cooling of thermally sensitive components and circuits. They are excellently suited for thermal management and cooling of high-power LEDs or applications in power electronics. The ceramic materials used are Rubalit® alumina and Alunit® aluminum nitride, which can feature a number of different metalizations. Moreover, with “chip on heat-sink” technologies the conductor paths are directly metalized on the heat-sink without any further thermal barriers. The power semiconductors are directly applied by soldering or silver sintering. The heat-sink itself is air or liquid cooled, which makes it possible to handle maximum power in the most compact of spaces.

CeramCool® Sandwich Cooling

The CeramCool® Sandwich Cooling system for double-sided cooling of power semi-conductors enables significantly higher power densities. Traditional cooling concepts only lead power loss away from the bottom of the chip. Virtually no heat is dissipated from the top of the chip, with the exception of the minimal amount of heat transported via the bonding wires and a minimal amount of heat dissipation. At PCIM Europe, CeramTec will show how the top of the chip can also be used for cooling. This makes it possible to reduce thermal resistance by up to 40% compared to cooling on just one side.

CeramCool® Liquid Cooling system

CeramCool® Liquid Cooling is one of the most efficient, long-lasting and reliable liquid cooling systems on the market. The ceramic cooling system is perfectly electrically insulated and can be used in any environment with any type of coolant because it is resistant to UV rays, chemical influences and salt water.

3D-substrate metalization in structured copper technology

In addition to classic thick-film conductive pastes with fine structures (Pitch 200µ), it is also possible to create electrically connected areas with thick copper metalization (up to 400µ) on the same substrate. In other words, this is the first time integrated circuits such as gate drivers or bus couplers have been incorporated together with the actual power semiconductor on a single substrate.

CeramTec in Hall 7, Stand 411

Site Map of the Messezentrum Nürnberg

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