Press Releases
CeramTec Press and Media Information
You will find our press releases in Adobe PDF format here. Please click on the title to display or download the PDF. If you require press information in a different format or would like to access the corresponding image materials, please send us an email.
| Date | Press Release |
|---|---|
| 2013 | |
| 2013-03-08 | Naturally Beautiful Teeth Thanks to CeramTec Ceramics manufacturer presents extended zirconia color palette at the IDS |
| 2011 | |
| 2011-11-25 | High-Power LED Modules for Materials Handling A new combination of Alunit ceramic and innovative liquid cooling makes it possible to create extremely compact power electronics. |
| 2011-01-20 | Higher, faster and ever lighter CeramTec: Ceramic and metal composite reduces weight. |
| 2010 | |
| 2010-12-14 | CeramCool® Street Concept's First Test Installation The city of Wunsiedel is cooperating with CeramTec to take steps toward the future with the launch of the CeramCool® Streetlight product study. |
| 2010-11-12 | Extruded Alunit Ceramics – World Premiere CeramTec GmbH has succeeded in achieving series extrusion of exceptionally thermally conductive aluminum nitride ceramics. |
| 2010-09-15 | One type of ceramic – numerous applications CeramTec: Zirconium oxide is first choice for mechanical engineering |
| 2010-04-08 | CeramCool® Made from Aluminum Nitride Ceramic Cools 75W / cm² World Premiere: CeramTec Presents Extruded Aluminum Nitride |
| 2010-04-08 | CeramCool® LED Lamp Kit Pre-optimized Modules for Customer-specific LED Lamps |
| 2009 | |
| 2009-12-12 | CeramTec “Preferred Supplier” of Bosch On November 25th, CeramTec was awarded the status “Preferred Supplier of the Bosch Group” in the “technical ceramics parts” materials field. |
| 2009-11-09 | CeramCool® Liquid Cooling allows almost any needed Cooling Capacity Air cooling reaches its limits at very high power densities. This is where liquid cooling is best suited. |
| 2009-11-09 | CeramCool®: The ceramic heat-sink as a module substrate The CeramCool® ceramic heat-sink is an effective combination of circuit board and heat-sink for the reliable cooling of thermally sensitive components and circuits. As a three-dimensional module substrate it solves numerous problems that arise due to a lack of space. |
