Alunit® The cool solution for electronic power
Extracting maximum power from minimum space inevitably means that the electronic componentry develops higher and higher temperatures. To protect these components, heat needs to be dissipated quickly and reliably. This is where aluminum nitride ceramic Alunit® sets new standards.
With its outstanding power insulating properties and extremely high heat conductivity (≥ 170 W/mK), Alunit® is perfect for higher-power electronic applications. Alunit® allows the assembly of compact and cost-effective components and hybrids with high integration density. Excellent mechanical strength and a low thermal coefficient of expansion permit problem-free systems integration.
CeramTec manufactures substrates and other components in a variety of surface finishes – each and every one well suited for thin-film and thick-film applications:
Alunit® surface
Alunit® surface: ground
Alunit® surface: polished
Dedicated manufacturing technologies assure maximum quality:
- Tape Casting
- Dry Pressing
- Lasering
Applications:
- Power Electronics
- IGBT Modules
- Telecommunications
- Cooling Devices
- DCB (Direct Copper Bonding)
- LEDs
Thermal conductivity comparison:
Plastics, Al2O3 and AIN.
