Metallized Rubalit® and Alunit® substrates
CeramTec is one of the leading manufacturers
internationally of metallized substrates on
an aluminum oxide (Rubalit®) and aluminum
nitride (Alunit®) basis. Over 30 years of
experience in manufacturing and a worldwide
presence with manufacturing and laser
facilities in Europe, North America and
the Far East make us the qualified partner
for the hybrid industry, for manufacturers
of electronic components and for the power
electronics industry. We metallize our ceramic
substrates on our own premises. The pastes
developed by CeramTec are characterized by
high adhesive strength, good flux and excellent
stability in solder baths. Their excellent
mechanical, electrical and thermal properties
make our metallized substrates suitable for use
in the following fields:
- Power electronics
Power modules, rectifiers, thyristors, ignition elements - Thermo-electrical applications
Peltier, heating and cooling elements - Optoelectronics
Light emitting diodes, optocouplers, photo diodes, photo transistors, reflex sensors, photo logic sensors - Substrates
Substrates for electrical inductors and sensors - Electronic applications
Special single-layer substrates for microelectronic semiconductors
Our stamped, lasered or dry-pressed ceramic substrates, with their excellent mechanical, electrical and thermal characteristics, are metallized on-site in our facilities.
The metallizing systems developed by CeramTec enable superior adhesion, high wettability, and excellent performance consistency in soldering baths.
Metallizing System
The base layer is tungsten, screen printed with a minimum layer thickness of 6 µm. An electrolytic nickel layer (approximately 2 µm) assures a good solder flow. Other thicknesses are available for specific customer requirements. Electrolytic nickel plating requires electrical connections for the plating process. Special design guidelines will therefore apply wherever an electrolytic technique is involved.
An optional gold flash layer (approximately 0,1 µm) may be added to enhance corrosion resistance. As a further option, the electrolytic nickel layer may be covered with a bondable gold plating. Solder finishes are also available.
Substrate Dimensions
For metallized substrates, the maximum standard dimension is 120 mm x 160 mm (4.7" x 6.3") for Rubalit® 708 S and Alunit®.
Cost efficiency can usually be obtained by selecting the dimensions of smaller individual substrate segments so as to achieve a maximum utilization of the master substrates.
Metallized holes are available on demand.
Product shapes of metallized standard coil forms
