CeramCool® for High Power LED-Systems of Tomorrow
High-power LED housings generally have a metallic surface in addition to the electrical
connections through which heat dissipates. This surface can now be directly and reliably
soldered to the heatsink with solder pads that are bonded directly to the CeramCool®
heat-sink. There is no need to settle for compromises such as clamping or gluing the high-power LED.
The simplified construction combined with a direct and durable bond between the high-power
LED and CeramCool® create ideal operating conditions for the entire assembly.
Critical values such as long-term stability, secure thermal management and reliability are
significantly improved.
To date, many different materials are used for the overall construction, which simultaneously
translates into numerous processes. A possible simplification with CeramCool® is
to equip the heat-sink, which is printed with circuits, in much the same way as a circuit
board and restore it to a functioning overall construction in a reflow process.
Benefits of CeramCool®
- Optimized thermal management
- Passive cooling
- Absorption of thermal stress
- Increased lifetime of die
- Higher color stability
- Reduction TCE missmatch
- Thermal expansion coefficient of semiconductor materials
- One system for alignment of sources
- Simplified system
- Miniaturisation
- Weight reduction
- Cost reduction
- High current conductors
For more information please contact:
CeramTec AG
Electronic Applications Division
Mr. Rüdiger Herrmann
CeramTec-Weg 1
D-95615 Marktredwitz
Phone: +49 9231 69-453
Fax: +49 9231 62409
r.herrmann@ceramtec.de