CeramCool® Technical Information
A Heat-Sink That Acts as a Component Part Carrier – Redefining Compactness
CeramCool can be coated directly with proven thick-layer technologies with its high adhesion force (WNi(Au), Ag, AgPd, Au, DCB, AMB...) or thin film processes with its smooth surfaces (allowing precise light angles). A finish for better soldering can be obtained using electroless nickel or gold (immersion or cathodic deposition).
A customer specific layout is applied on the surface and packed with components. Qualified processes and RoHS-conform materials, applied for decades in aerospace or automotive industries, can be used.
The possibility of metallization makes the whole surface of the heat-sink useable as a circuit carrier which can be firmly packed with LEDs and drivers on customized circuit layouts – while providing reliable electrical insulation. The process can be simplified by bonding the chip directly onto the specially designed CeramCool metallic surface. Chip on heat-sink – compact and simple.
Customized three-dimensional application of circuit structures.
Metallization of cavities.
CeramCool With Various Forms of Metallization
CeramCool with various forms of metallization for the widest range
of applications.
Tungsten, tungsten-nickel, and tungsten nickel-gold metallizations are standard. Other forms are also possible such as silver, silver-palladium, or gold. With CeramCool, direct copper bonding for power electronic applications is also possible, and even the three-dimensional application of circuit structures.
Comparison of Die Temperature. Harsh Conditions. Die 1.5 x 1.5 mm². 10 W Excess Heat.
Aluminium Heat-Sink, Glue Layer 50μm, 2 W/mK,
max. Die Temperature 169 °C
Ceramic Heat-Sink CeramCool
with metallization pad, Solder 50μm,
60 W/mK. CeramCool becomes hot,
dissipating the heat without restrictions.
Max. Die Temperature 82 °C
Aluminium Heat-Sink remains cool and works with delay.
CeramCool works immediately. Becoming hot, it cools the LED.
The Fraunhofer Institute in Nuremberg, Germany, compared two heat-sinks of the same geometry with regard to their surface temperature: a typical aluminum fin cooler with a glue bonded chip versus CeramCool made of Rubalit® with a metallization pad and directly soldered LED. The aluminum heat-sink remains relatively cool, but the chip reaches a maximum temperature of 169 °C. Heat dissipation is blocked by the adhesive layer required for the aluminum assembly. The ceramic heat-sink, in contrast, becomes hot and dissipates the heat over its surface, taking the burden off the LED and cooling the critical components. The chip reaches a maximum temperature of 82 °C. This happens for a simple reason: the chip is directly and reliably bonded to the electrically insulating CeramCool, using only metals. The result is convincing – the chip’s temperature doesn’t exceed half the temperature of the aluminum assembly.
Dynamic of Die Temperature. With Copper Spreader, For Fast Lateral Heat Conduction.
Temperature difference in starting phase.
Temperature difference in working process.
Proof of the system’s high dynamics: after 0.1 seconds, CeramCool reaches a temperature of only 45 °C versus approx. 60 °C with aluminum. The resulting load reduction increases component lifetime considerably.
CeramTec AG
Electronic Applications Division
Mr. Rüdiger Herrmann
CeramTec-Weg 1
D-95615 Marktredwitz
Phone: +49 9231 69-453
Fax: +49 9231 62409
r.herrmann@ceramtec.de