CeramCool® Ceramic Heat-Sink
Optimized Thermal Management for High Power Electronic Systems of Tomorrow
It’s new, simple and extremely reliable. CeramCool® is the ideal base for thermal
management of high power electronic systems. CeramCool® is available from the
proven ceramic materials Rubalit® 708, Alunit® and
other materials upon request. The materials listed above have a thermal expansion coefficient
that is adapted to semi-conductor materials, possess excellent electrical characteristics
and are at the same time corrosion-resistant.
CeramCool® can be metallized directly with thick or thin film processes such as
conventional ceramic substrates. This makes the complete surface of the heat-sink
useable as a circuit carrier while providing reliable electrical insulation.
CeramCool® material characteristics
- Electrical insulation
- High volume resistivity
- Thermal cycling stability
- High breakthrough voltage
- No corrosion
- No water intrusion
For more information please contact:
CeramTec AG
Electronic Applications Division
Mr. Rüdiger Herrmann
CeramTec-Weg 1
D-95615 Marktredwitz
Phone: +49 9231 69-453
Fax: +49 9231 62409
r.herrmann@ceramtec.de